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06T1004F 00020 13009 ACOF5S3E CA2818C 014SBDY 2SD1733 S5128
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  multilayer ceramic chip capacitors 1 of 3 creation date : june 02, 2017 (gmt) c3225x7r1c106m200ab tdk item description c3225x7r1c106mt**** applications commercial grade please refer to part no. cga6m3x7r1c106m200ab for automotive use. feature general general (up to 50v) series c3225 [eia 1210] status production (not recommended for new design) size length(l) 3.20mm 0.40mm width(w) 2.50mm 0.30mm thickness(t) 2.00mm 0.20mm terminal width(b) 0.20mm min. terminal spacing(g) recommended land pattern (pa) 2.00mm to 2.40mm recommended land pattern (pb) 1.00mm to 1.20mm recommended land pattern (pc) 1.90mm to 2.50mm electrical characteristics capacitance 10f 20% rated voltage 16vdc temperature characteristic x7r(15%) dissipation factor (max.) 7.5% insulation resistance (min.) 10m other soldering method re?ow aec-q200 no packing blister (plastic)taping [180mm reel] package quantity 1000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : june 02, 2017 (gmt) c3225x7r1c106m200ab characteristic graphs (this is reference data, and does not guarantee the products characteristics.) impedance c3225x7r1c106m200ab esr c3225x7r1c106m200ab capacitance c3225x7r1c106m200ab dc bias characteristic c3225x7r1c106m200ab temperature characteristic c3225x7r1c106m200ab(no bias) c3225x7r1c106m200ab(dc bias = 8v ) ripple temperature rising c3225x7r1c106m200ab(100khz) c3225x7r1c106m200ab(500khz) c3225x7r1c106m200ab(1mhz) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : june 02, 2017 (gmt) c3225x7r1c106m200ab associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.


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